 PRODUCTS Essemtec
Essemtec is a Worldwide leader in manufacturing of highly flexible Surface Mount Technology (SMT) production equipment.
Essemtec systems are optimized for maximum flexibility. The user can switch from one product to another in no time and get maximum use of the available production capacity. |
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| PUMA - Relentless Strong Pick & Place |
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PUMA High Speed Pick-and-Place System.
The Puma is flexible in any direction and versatile from prototyping to hi-speed production.
High speed placement and jet dispensing
2 or 4 placement axis
1 - 2 dispense processes
Optimum 18,100cph & 145,000 dots/hour
Up to 280 feeders
Non-stop feeder and production changeover
Component 01005 - 33x80 mm (80x80mm
opt)
Small footprint
1,55M x 1,357M
STRONG, FLEXIBLE, ADAPTIVE & MODULAR
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| FOX - Smart-Sized Modular Pick and Place |
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FOX Highly Flexible Pick-and-Place System.
Highly flexible SMT pick-and-place machine with high feeder capacity. Ideal for small and medium enterprises.
Optimal placement speed up to 7,000 cph
Jet dispensing of solder or glue
Component 01005 - 33x80 mm (80x80mm opt)
Feeded capacity 8mm - 180 (120 inline)
Nonstop feeder and production changeover
Ideal for SME
COMPACT, CLEVER, SIMPLE & AGILE
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| SPIDER - Smart Sized High Speed Dispenser |
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SPIDER - Versatile, Accurate, Artistic & Reliable
State of the art technology with a wide range of applications, such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam and Fill, Underfill, Cavity Fill, 3D Dispensing via laser height mapping and more.
Easily adaptable
for your application
5 different valves - large application range
Up to 2 valves simultaneously
Up to 150,000 dots/hour (with piezo jet valve)
Small footprint - requires 1 sq.mtr floor spaceDispense area 406mm x 305mm
Laser height mapping
In-line or standalone
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| TARANTULA - Relentless All-Terrain Dispenser |
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TARANTULA - Precise, Strong, Adaptive & Versatile
Wide range of dispensing applications such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam and Fill, Underfill, Cavity Fill, 3D Dispensing via laser height mapping and more.
Up to 3 dispense valves simultaneously
5 different valves - large application range
Up to 145,000 dots/hour (with piezo jet valve)
Large pcb size 560x610mm (opt. 1800 x 610mm)
Laser height mapping
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| CUBUS - Connective Component Storage Solution |
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CUBUS Fully Automatic SMD Storage System.
The Cubus flexible SMD storage system has user-adjustable shelves that can be varied in 5 mm steps and are auto-configured. Thus reels of all sizes, trays and boxes are easily accommodated. Moreover, the shelves occupy either two small 7" reels or one 13 or 15" reel, further optimizing packing density without compromising flexibility.
Storage capacity from 612 to 1540 8mm reels
SMD reels of all sizes, trays, boxes and more
2 system sizes - unlimited storage capacity
Modularly expandable
Fully automatic loading and unloading
Full traceability of all stored items
Full interface to most production systems and
all major ERP and material management
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| RO400FC - Reliable Full Convection Reflow Ovens |
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The RO400FC versatile full convection reflow oven guarantees reliable soldering
processes for standard and unleaded use.
Integrated microprocessor for profile control and storage. Extra high air volume for perfect soldering of complex boards.
5 zone reflow oven
400mm process width
Soldering or curing
Lead-free processing
Mesh belt or chain conveyor
COMPACT, STABLE, UNIFORM & EFFICIENT
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